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RF Plasma Etcher/Asher/Cleaner

The K1050X is a modern, solid-state RF plasma barrel reactor designed to meet the requirements of research and development and small-scale production for a wide and varied range of plasma etching, plasma ashing and plasma cleaning applications.

RF Plasma Etcher/Asher/Cleaner

Contacts and Location

Contact 1 Atis Skudra
Enquire about this equipment
Organisational Unit Institute of Atomic Physics and Spectroscopy
    University of Latvia
Building Rīga, Šķūņu iela 4

Description

The K1050X is a modern, solid-state RF plasma barrel reactor designed to meet the requirements of research and development and small-scale production for a wide and varied range of plasma etching, plasma ashing and plasma cleaning applications.

Specification

Built to withstand heavy use - 24 hours a day for some plasma ashing schedules - the K1050X RF Plasma Barrel Reactor features microprocessor control with automatic operation and offers durability and simplicity of operation. Barrel systems plasma etch or plasma ash isotropically (in all directions) and are suitable for a wide range of applications. The K1050X uses a low pressure RF-induced gaseous discharge to modify specimen surfaces or remove specimen material in a gentle, controlled way. A significant advantage over alternative methods is that the plasma etching and ashing processes are dry (no wet chemicals are needed) and take place at relatively low temperatures.

Services

A wide range of surface modification methods are available, using a variety of process gases. Using oxygen (or air) as the process gas, the molecules disassociate into chemically active atoms and molecules and the resulting ‘combustion’ products are conveniently carried away in the gas stream by the vacuum system.

Funding Source

National Research Centers (VNPC) -
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