GF-B-HT Mini Reflow Oven

Mini-sized batch reflow oven provides forced air convection heating technology with individual time and temperature controls to make profile set up quick and easy.

Contacts and Location

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Organisational Unit	Riga Technical University Faculty of Electrical and Environmental Engineering Institute of Industrial Electronics and Electrical Engineering - Latvia, Rīga

Description

Mini-sized batch reflow oven provides forced air convection heating technology with individual time and temperature controls to make profile set up quick and easy.

Specification

Max board width: 305mm x305mm Max board height: 32mm Heating zones: One (1) Max temperature: 315°C CyclonicsTM (forced air): One (1) Conveyor extensions: Dual board shuttle Cooling station: Two (2) Nitrogen option: Yes

Services

Soldering

Contract title

Lodēšanas krāsns

Contract short description

Mazizmēra virsmas montāžas lodēšanas krāsns ar piespiedu karstā gaisa konvekciju. Iestatāma temperatūra, laiks un profils optimālai lodēšanai.

Contract full description

Plates izmērs: 305mm x305mm Plates augstums: 32mm Sildīšanas zonas: viena (1) Maksimālā temperatūra: 315°C CyclonicsTM (gaisa plūsma): viena (1) Konveijers: divu plašu atvilktne Dzesēšanas novietnes: divas (2) Ir izveidojama slāpekļa atmosfēra

Funding Source

EU Structual Funds (ERAF, ESF)	-

GF-B-HT Mini Reflow Oven

Mini-sized batch reflow oven provides forced air convection heating technology with individual time and temperature controls to make profile set up quick and easy.

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