Contacts and Location
Contact 1 | Raimonds Meija |
---|---|
Enquire about this equipment | |
Organisational Unit |
Institute of Chemical Physics University of Latvia |
Description
Semiautomatic Wire Bonder for wedge and ball bonding
Specification
Services
This instrument is a multipurpose semiautomatic wire bond tool for R&D purposes. There is one bond head available for wegde/wedge, ball/wedge and bump bonding mode. There is no hardware change necessary. Direct access and simple adjustment to all bond parameters and programs allow easy handling of the tool
Manufacturer
UniTemp GmbH
Model
WB-100