Contacts and Location
|Contact 1||Andris Jakovičs|
|Enquire about this equipment|
Department of Physics
Faculty of Physics and Mathematics
University of Latvia
|Building||Rīga, Zeļļu 8|
Thermal conductivity analyser employs the modified transient plane source (MTPS) technique in characterizing the thermal conductivity (lambda) and effusivity of materials. It employs a one-sided, interfacial heat reflectance sensor that applies a momentary constant heat source to the sample. Typically, the measurement pulse is between 1 to 3 seconds. Thermal conductivity and effusivity are measured directly, providing a detailed overview of the heat transfer properties of the sample material. For samples with known density, it is possible to calculate also heat capacity. Pushrod dilatometry is a method for characterizing dimensional changes of a material as a function of temperature. The coefficient of thermal expansion (α) is defined as the degree of expansion (ΔL) divided by the change in temperature (ΔT). A precise understanding of thermal expansion behaviour provides crucial insight into firing processes, the influence of additives, reaction kinetics and other important aspects of how materials respond to environmental changes. Typical applications include: the determination of the coefficient of thermal expansion, annealing studies, determination of glass transition point, softening point, and densification.
For thermal conductivity analyser: thermal conductivity (lambda) range: 0 to 500 W/mK, test time: 0.8 to 3 seconds, minimum sample testing Size: 17mm in diameter, temperature Range: from -50º to 200ºC using climatic chamber, accuracy: better than 5%; precision: better than 1%. Possibility to measure of heat capacity for materials with known density. For dilatometer module: temperature range: room temperature to 1600°C, temperature resolution: 0.1°C, max displacement 4mm, sample dimensions 10 to 50mm long with diameter 4 - 12mm, rate of temperature increase - up to 50ºC/min.
For thermal conductivity analyser: fast measurements of thermal conductivity and thermal effusivity, heat capacity measurements. For dilatometer module: determination of the coefficient of thermal expansion; determination of glass transition point, softening point, and densification.
|EU Structual Funds (ERAF, ESF)||-|