Share this
Map

Semiautomatic Wire Bonder for wedge and ball bonding, UniTemp GmbH

Semiautomatic Wire Bonder for wedge and ball bonding

Semiautomatic Wire Bonder for wedge and ball bonding, UniTemp GmbH

Contacts and Location

Contact 1 Raimonds Meija
Enquire about this equipment
Organisational Unit Institute of Chemical Physics
    University of Latvia

Description

Semiautomatic Wire Bonder for wedge and ball bonding

Specification

  • Hot chuck (60 mm diameter, height adjustable)
  • Wedge and Ball bonding (easy tool change)
  • 17 μm up to 50 μm wire
  • 25 μm Gold and Aluminium wire is used for most applications.
  • Digital programming with LCD display
  • Deep-access bond head 16 mm
  • Bond arm length 165 mm
  • Heater stage and tool heater controller
  • Motorized 2“ wire spool holder
  • 6:1 ratio X-Y manipulator
  • Loop height programmable
  • Ultrasonic system: PLL control 62 kHz transducer
  • Ultrasonic power: 0 - 2 watt
  • Bond time: 15 - 5000 msec.
  • Bond force: 15 - 100 cN
  • Ball bonding tool: 1,58 (dia.) x 19 mm length
  • Gold wire diameter: 17 - 50 μm

Services

This instrument is a multipurpose semiautomatic wire bond tool for R&D purposes. There is one bond head available for wegde/wedge, ball/wedge and bump bonding mode. There is no hardware change necessary. Direct access and simple adjustment to all bond parameters and programs allow easy handling of the tool

Back to all
0 items in cart
Total: 0
You have no items in a cart
Go to checkout
Go Enquire